The project begins now:
Solder stencils are composed of tin alloy and auxiliary two parts, the alloy is divided into tin lead, lead-free additives evenly into the middle of the tin alloy. Different types of solder stencil different additives, additives part is to improve the solder wire in the welding process of secondary heat transfer, remove the oxidation, reduce the surface tension of the material to be welded, to remove the surface of the welding material oil, increase the welding area.
As to this question, what are the features of solder stencils, I have my own point of views:
1, Good wetting, conductivity, thermal conductivity, easy on the tin.
2, Winding even knot, on the tin speed, very little residue.
3, Tin wire diameter from 0.5-3.0mm can be customized production.
4, According to customer requirements custom rosin content%, welding is not splashing.
5, Flux distribution evenly, tin core in the absence of flux phenomenon.
Applications for solder stencils:
Computer motherboard, computer peripherals, communications products, household appliances, medical equipment, power boards, UPS, etc.
Uses: the lowest melting point, tensile strength and shear strength, good wetting, suitable for high-end electronic products or high demand for electronic, electrical industry.
Ps: Excuse me if I was wrong in words or expressions as I am a green hand in the field of solder stencils. I need continual learnings.
What is your idea ? Do you agree with my ideas ? Any of your ideas would be highly appreciated.
May someone would like to help ?
thanks in advance.